Can be provided at low cost by customizing systems to accommodate customers when being installed, and reducing startup times.
The external configuration is suitable for existing clean rooms.
Main unit dimensions: H2600 x W900 x D1280
Major components and software are developed by our company, allowing maintenance to be continued well into the future.
Various types of customization to respond to customer needs are possible.
Small footprint allowing installation in place of horizontal furnaces.
Energy savings of 10% compared to our company's past products have been achieved by the development of high-efficiency heaters.
Optional support can also accommodate high-speed temperature increases and decreases, or high-temperature processes.
|Structure:||Vertical downward-opening system|
|Process wafer diameter:||4, 5, 6, 8 inch|
|Treatment quantity:||Process wafers: 150 wafers (6-inch or less) or 100 wafers (8-inch)|
|Cassette storage:||Up to 8 cassettes including process and dummy cassettes (6-inch or less)|
|Up to 6 cassettes including process and dummy cassettes (8-inch or less)|
|Processes:||WET, DRY, ANNEAL, etc.|
|Usable gases:||N2, O2, H2, etc.|
|Wafer handling:||3 wafers fixed (standard), 5 wafer batch/1 wafer (option)|
|Temperature increase and decrease rates:||Temperature increase: max. of 10℃/min|
Temperature decrease: max. of 3℃/min