Product Details

Product Details
Product Details

Vertical Heat Treatment Furnace /
DF1600

This apparatus is a vertical heat treatment furnace (diffusion furnace) used for heat treatment processes in semiconductor manufacturing processes. The semiconductor manufacturing field is currently undergoing a change from mass production to production of various product types in small quantities. This apparatus allows small-capacity, high-speed treatment, while having a size that makes it possible to install in existing clean rooms.
Features

■High-speed temperature increases and decreases are possible (compatible with FTP)
A unique heater employing a vertical resistance heating system enables high-speed temperature increases and high speed at high temperatures, allowing both processing with high-speed temperature increases and decreases, and standard processing, to be performed with a single unit.

■Our company's unique wafer transfer system
The apparatus has a highly-reliable drive section using our company's unique wafer transfer system.

■Equipped with a pitch conversion mechanism
The groove pitch on the boat side can be converted to any desired pitch for wafer transfer (setting range: 4.76 - 9.52 mm). Wafer transport is carried out cassette-to-cassette.

■Equipment that emphasizes productivity and usability
The control component employs a TFT panel with a touch screen, for equipment with high productivity and usability.

■Low-temperature wafer furnace entry is possible
Low-temperature wafer furnace entry is possible, so the effects of air entrainment can be reduced substantially.

■Safe and easy removal and installation of reaction tubes
Using an automatic elevator, reaction tubes can be removed and installed more safely and easily.

■Unique temperature control system
The heater and temperature control system employ unique methods for dramatic improvement of temperature recovery characteristics.

■Maintainability
Great consideration has been given to the design so that even if multiple units are installed, their maintainability and usability will not be lost.

Specifications
●Basic specifications
StructureVertical downward-opening system
Process wafer diameterφ100 mm - φ200 mm
Treatment methodsBatch treatment
Treatment of 50 wafers / batch
Cassette storageUp to 9 cassettes including process, monitor, and dummy cassettes
ProcessesWET, DRY, ANNEAL, BAKE, etc.
Usable gasesN2, O2, H2, etc
Wafer handlling5 wafers batch/1 wafer
Temperature increase and decrease rates Temperature increase: max. of 100℃/min
Temperature decrease: max. of 50℃/min