■Cost performance
Can be provided at low cost by customizing systems to accommodate customers when being installed, and reducing startup times.
■Space-fitting performance
The external configuration is suitable for existing clean rooms.
Main unit dimensions: H2600 x W900 x D1280
■Maintenance performance
Major components and software are developed by our company, allowing maintenance to be continued well into the future.
■Customization performance
Various types of customization to respond to customer needs are possible.
■Product performance
Small footprint allowing installation in place of horizontal furnaces.
■Energy performance
Energy savings of 10% compared to our company's past products have been achieved by the development of high-efficiency heaters.
Optional support can also accommodate high-speed temperature increases and decreases, or high-temperature processes.
●Basic specifications | |
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Structure: | Vertical downward-opening system |
Process wafer diameter: | 4, 5, 6, 8 inch |
Treatment quantity: | Process wafers: 150 wafers (6-inch or less) or 100 wafers (8-inch) |
Cassette storage: | Up to 8 cassettes including process and dummy cassettes (6-inch or less) |
Up to 6 cassettes including process and dummy cassettes (8-inch or less) | |
Processes: | WET, DRY, ANNEAL, etc. |
Usable gases: | N2, O2, H2, etc. |
Wafer handling: | 3 wafers fixed (standard), 5 wafer batch/1 wafer (option) |
Temperature increase and decrease rates: | Temperature increase: max. of 10℃/min Temperature decrease: max. of 3℃/min |